MingZhengHong ElectronicsMingZhengHong Electronics
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production capacity MP the limit production capacity MP the limit
Highest layer 28 32 Maximum working board size mm 622.5*726 622.5*780
Thickness of laminated board mm 0.3—6.5 Maximum working board size single-sided 546*1200 622*1500
Plate thickness tolerance +/-10% ± 0. 05mm Minimum dielectric layer thickness( mm ) 0. 075 0. 05
Minimum aperture( mm ) 0. 2 0. 15 COB minimum bonding finished product width 3mil
Laser blind hole mm 0.075—0.25 PTH finished product aperture tolerance ± 0. 075 ± 0. 05
Maximum inner copper thickness( OZ ) 4 5 Maximum outer copper thickness( OZ ) 5 6
Inner/outer line width and spacing( mil ) 2.5/ 2.5 2/ 2 Minimum Green Oil Bridge mil 3 2.5
Depth tolerance of countersunk hole mm ± 0. 125 ± 0. 075 Electric gold thicknessU” 10—80
aspect ratio 5--10:1 18:1 impedance ±10%(>50Ω) +/-5%>50Ω(max) ± 10%(≤50Ω)
Back drilling depth tolerancemm ± 0. 1 ± 0. 05 POFV YES
HDI 1+N+1 2+N+2 Forming tolerance ± 0. 1 ± 0. 05
Single sided sheet metal 22F .FR-1.FR-2.CEM-1.CEM-3.Aluminum-based.Copper-based
FR-4 SY.GW.KB.EMC.VT, IT, TUC,NY/NP.
high frequency Shengyi, Ventec,Rogers, AGC,Taikoni.
high speed EMC.TUC. ISOLA. MEGTRON 6.IT.SY
Conventional surface treatment process
Electric gold finger NI/AU liberal remuneration NiPdAu ENEPIG immersion silver Immersion Tin OSP HAL
Special process technology
Leadless long short graded gold finger+OSP+HAL+gold plating+silver plating+tin plating (choose one) Selective selection+ OS P back drill POFV AR 18:1 LDI high frequency Optical module10-400G Half hole Metal edging Carbon Oil Blue Glue IMPEDANCE BOARD Mini --led COB Blind hole board
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